文摘

发展趋势的外推技术领域的复杂电子设备显示了日益复杂的半导体技术。这种发展电子设备的构造函数有如此担心安装和互连技术的进展已经第二个地方。这个快速发展微电子产业间日益加深的分歧,macroelectronics行业的一个保守的州,是一个驱动力对有效连接技术的进步在每一个级别的。所有系统的技术解决方案将变得更加协调。印刷电路板组件的安装是一个传统的焊接操作。这个原则导致完全自动化的发展,和是一个标准的安装技术。然而集成在芯片级的增长已经带来了新的要求,只有满意的困难。新开发的需求表明,使用双列直插式包将不满意。新方法必须设计芯片直接连接到印刷电路板,从芯片作为最小的安装单位。要求非常复杂的电子设备的高度集成(LSI或超大规模集成)不满意使用传统安装系统。这些需要一个全新的概念,从芯片到印刷电路板。In this paper alternatives to printed circuit board technology with insulated wiring (multilayers), and the mounting of chips from film carriers, are evaluated. These principles have a good possibility of further improvement as progress in mounting technology continues.Price reductions cause an extension of application possibilities and an extension of electronic designs. It is harder to make choices for new designs when there are more degrees of freedom. However the function of chips as the basic element is unchangeable and optimum designs need to be based on this concept.